Tin in a vial
Tin in a vial
- Soldering binder with flux in a vial.
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Tin content
59,5%-60,5%
Thickness
1 mm
Weight
16g
Melting point
183 ~ 190°C
Operating temperature
320 ~ 420°C
Soldering binder used in the manufacture of standard electronic and electrical equipment and components. Undoubtedly suitable for soldering components with tin, tin-lead, cadmium, zinc and silver plating.
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