Tin in a vial

Soldering binder with flux in a vial.

Tin content

59,5%-60,5%

Thickness

Weight

Melting point

183 ~ 190°C

Operating temperature

320 ~ 420°C

Soldering binder used in the manufacture of standard electronic and electrical equipment and components. Undoubtedly suitable for soldering components with tin, tin-lead, cadmium, zinc and silver plating.

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Tin in a vial

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